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Layout analysis
Verification of package pin to die pad connection for circuit analysis has been conventionally performed by X-ray imaging; however, within modules and multilayer PCBs, metal interconnect tracing by X-ray analysis is not practical. Therefore, use of delayering, layer by layer digitization followed by automatic, semiautomatic or manual circuit tracing is indispensable.
Through layer-by-layer deconstruction of the module and the multi-layer PCB, the internal connections, design rules, and internal system details are revealed.
Example
Planar layout and design rule analysis by delayering n FPGA module
Actual results for a variety of modules ( FC-BGA, LTCC, PCBs) are shown.
![](https://static.wixstatic.com/media/6c8577_81d47e7b0c40457682762d2c742d0c4f~mv2.png/v1/fill/w_600,h_486,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/6c8577_81d47e7b0c40457682762d2c742d0c4f~mv2.png)
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